产品概览
文档与媒体
- 数据列表
- 5AGZME3E2H29I3LG
产品详情
- I/O 数 :
- 342
- LAB/CLB 数 :
- 16980
- 供应商器件封装 :
- 780-HBGA(33x33)
- 安装类型 :
- 表面贴装型
- 封装/外壳 :
- 780-BBGA,FCBGA
- 工作温度 :
- -40°C ~ 100°C(TJ)
- 总 RAM 位数 :
- 23946240
- 栅极数 :
- -
- 电压 - 供电 :
- 0.82V ~ 0.88V
- 逻辑元件/单元数 :
- 360000
采购与库存
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