文档与媒体
- 数据列表
- AGFA027R24C3I3E
产品详情
- RAM 大小 :
- 256KB
- 主要属性 :
- FPGA - 2.7M 逻辑元件
- 供应商器件封装 :
- -
- 外设 :
- DMA,WDT
- 封装/外壳 :
- -
- 工作温度 :
- -40°C ~ 100°C(TJ)
- 架构 :
- MPU,FPGA
- 核心处理器 :
- 带 CoreSight™ 的四核 ARM® Cortex®-A53 MPCore™,ARM NEON,浮点
- 连接能力 :
- EBI/EMI,以太网,I²C,MMC/SD/SDIO,SPI,UART/USART,USB OTG
- 速度 :
- 1.4GHz
- 闪存大小 :
- -
采购与库存
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