产品概览
文档与媒体
- 数据列表
- XCZU6CG-1FFVC900I
产品详情
- RAM 大小 :
- 256KB
- 主要属性 :
- Zynq®UltraScale+™ FPGA,469K+ 逻辑单元
- 供应商器件封装 :
- 900-FCBGA(31x31)
- 外设 :
- DMA,WDT
- 封装/外壳 :
- 900-BBGA,FCBGA
- 工作温度 :
- -40°C ~ 100°C(TJ)
- 架构 :
- MCU,FPGA
- 核心处理器 :
- 带 CoreSight™ 的双核 ARM® Cortex®-A53 MPCore™,带 CoreSight™ 的双核 ARM® Cortex™-R5
- 连接能力 :
- CANbus,EBI/EMI,以太网,I²C,MMC/SD/SDIO,SPI,UART/USART,USB OTG
- 速度 :
- 500MHz,1.2GHz
- 闪存大小 :
- -
采购与库存
推荐产品
您可能在找
WK73R2HTTE1820F
WK73R2HTTE4300F
WK73R2HTTE4533F
WK73R2HTTE1623F
WK73R2HTTE4703F
WK73R2HTTE9763F
WK73R2HTTE18R7F
WK73R2HTTE6042F
WK73R2HTTE2673F
WK73R2HTTE3652F
WK73R2HTTE56R0F
WK73R2HTTE5360F
WK73R2HTTE1742F
WK73R2HTTE1133F
WK73R2HTTE2942F
WK73R2HTTE3303F
WK73R2HTTE1003F
WK73R2HTTE9312F
WK73R2HTTE16R2F
WK73R2HTTE24R3F