产品概览
文档与媒体
- 数据列表
- MC33PF8200CXES
产品详情
- 供应商器件封装 :
- 56-HVQFN(8x8)
- 安装类型 :
- 表面贴装,可润湿侧翼
- 封装/外壳 :
- 56-VFQFN 裸露焊盘
- 工作温度 :
- -40°C ~ 105°C(TA)
- 应用 :
- 基于高性能 i.MX 8,S32x 处理器
- 电压 - 供电 :
- 2.5V ~ 5.5V
- 电流 - 供电 :
- -
采购与库存
推荐产品
您可能在找
CRGCQ1206J470K
CRGCQ1206J1M0
CRGCQ1206J2M2
CRCW04021R50FNED
RK73H1HTTC6492F
RK73H1HTTC1103F
RK73H1HTTC3402F
RK73H1HTTC1581F
RK73H1HTTC6981F
RK73H1HTTC5111F
RK73H1HTTC7151F
RK73H1HTTC1582F
RK73H1HTTC8062F
RK73H1HTTC4122F
RK73H1HTTC2102F
RK73H1HTTC3483F
RK73H1HTTC1962F
RK73H1HTTC6802F
RK73H1HTTC1100F
RK73H1HTTC3242F